The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2005
Filed:
Aug. 24, 2001
Takuji Sugiyama, Shizuoka, JP;
Daisuke Uratani, Tokyo, JP;
Tomohito Hayama, Shizuoka, JP;
Masafumi Oishi, Shimizu, JP;
Souichirou Katayama, Tokyo, JP;
Kazuo Ariyoshi, Tokyo, JP;
Tetsurou Kawamoto, Shizuoka, JP;
Takuji Sugiyama, Shizuoka, JP;
Daisuke Uratani, Tokyo, JP;
Tomohito Hayama, Shizuoka, JP;
Masafumi Oishi, Shimizu, JP;
Souichirou Katayama, Tokyo, JP;
Kazuo Ariyoshi, Tokyo, JP;
Tetsurou Kawamoto, Shizuoka, JP;
Sun A. Kaken Co., Ltd., Tokyo, JP;
Abstract
A packaging body for heat processing a material retained therein is basically formed of a plastic base material having side joining sections, and end sides. The side joining sections and end sides are superposed and connected together to form a bag for filling the material. A sealant layer is deposited on at least one of the end sides to connect the end sides together through the sealant layer to thereby form a vapor communication joining section at the end sides. The sealant layer has a peeling off property from 0 to 1,200 gf/15 mm at 90° C. and a peeling off property of equal to or more than 3 kgf/15 mm at a room temperature. Thus, only when the packaging body is heated more than 90° C., the vapor communication joining section is only opened to release pressure inside the packaging body.