The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2005
Filed:
Jun. 24, 2002
Tatsuo Fujii, Osaka, JP;
Katsumasa Miki, Hirakata, JP;
Makoto Nakano, Neyagawa, JP;
Suzushi Kimura, Toyonaka, JP;
Yuji Mido, Higashiosaka, JP;
Tatsuo Fujii, Osaka, JP;
Katsumasa Miki, Hirakata, JP;
Makoto Nakano, Neyagawa, JP;
Suzushi Kimura, Toyonaka, JP;
Yuji Mido, Higashiosaka, JP;
Abstract
A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foilis made porous in one of the surfaces, a dielectric layeris formed on the porous portion, a through holeis provided in the aluminum foilat a certain specific location. An insulation layeris formed to cover the other surface, viz. non-porous surface, of the aluminum foiland the inner wall surface of through hole, a solid electrolytic layeris provided on the dielectric layer, and a through hole electrodeis formed in the through hole, and then a collector layeris formed on the solid electrolytic layer. The insulation layerdisposed on aluminum foilis provided with an openingat a certain specific location, and a connection terminalis provided at the openingof insulation layerand the exposed surface of the through hole electrode, respectively.