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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6854853 B1

PDFFull Text
Expired
Date of Patent:
Feb. 15, 2005

Filed:

Mar. 17, 2003

Method for wave soldering of surface mounted light emitting diodes

Applicants:

Christopher L. Rovik, Canton, MI (US);

Wesley R. Corrion, Fenton, MI (US);

Ricardo Hernandez, Canton, MI (US);

Adrian G. Gheorghiu, Troy, MI (US);

Inventors:

Christopher L. Rovik, Canton, MI (US);

Wesley R. Corrion, Fenton, MI (US);

Ricardo Hernandez, Canton, MI (US);

Adrian G. Gheorghiu, Troy, MI (US);

Assignee:

Visteon Global Technologies, Inc., Dearborn, MI (US);

Attorney:

Brinks Hofer Gilson & Lione

Primary Examiner:

Sandra O'Shea

Assistant Examiner:

Mark Tsidulko

Int. Cl.
CPC ...
G01D011/28 ;
U.S. Cl.
CPC ...
Abstract

An instrument cluster for communicating a vehicle's operating status to a vehicle occupant is disclosed. The instrument cluster includes a housing for supporting the instrument cluster. The housing is mountable to a vehicle instrument panel. A circuit board is secured to the housing. A motor having a motor shaft is rotatably coupled to the motor and the motor is secured to the circuit board. A gauge pointer is mounted on the motor shaft and rotatable therewith for indicating the vehicle's operating status. At least one diode is provided for illuminating the gauge pointer and at least one diode 'footprint' is disposed on the circuit board proximate the motor shaft for electrically interconnecting the at least one diode to the circuit board. The at least one diode 'footprint' has a cathode solder pad and an anode solder pad. The anode solder pad is substantially rectangular and the cathode solder pad is substantially L-shaped.

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Rovik, Christopher. (2005). Method for wave soldering of surface mounted light emitting diodes (U.S. Patent No. 6854853). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6854853

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