The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2005
Filed:
Oct. 22, 2002
Jyunichi Aizawa, Tokyo, JP;
Hiroshi Fukumoto, Tokyo, JP;
Yasufumi Nakasu, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A nozzle ejects molten metal in an ejecting direction. The nozzle has a solder-philic surface in a first region and a solder-repellent surface in a second region. The second region is located forward of the first region in the ejecting direction. Before molten metal is ejected, the peripheral edge of the liquid surface of the molten metal is held at a position located further forward in the ejecting direction than the boundary between the solder-philic surface and the solder-repellent surface. The peripheral edge of the liquid surface is thus held before being ejected so that solder drops can be ejected steadily with a uniform diameter, constant direction, and constant speed.