The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2005
Filed:
Jan. 24, 2002
Applicants:
Gottfried Ferber, Warstein, DE;
Reimund Pelmer, Soest, DE;
Inventors:
Gottfried Ferber, Warstein, DE;
Reimund Pelmer, Soest, DE;
Assignee:
EUPEC GmbH, Warstein, DE;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/48 ;
U.S. Cl.
CPC ...
Abstract
A semiconductor module and a method for its fabrication are described. The semiconductor module has at least one semiconductor component that is disposed directly on a substrate body. The substrate body has an insulating ceramic provided with a metal layer. At least one connection conductor is joined to the metal layer by welding, in particular laser microwelding.
Ferber, Gottfried. (2005). Semiconductor module and method for fabricating the semiconductor module (U.S. Patent No. 6853088). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6853088
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile