The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2005
Filed:
Oct. 01, 2002
Applicants:
Seishi Oida, Kyoto, JP;
Sigeki Sakaguchi, Kyoto, JP;
Koji Ohmori, Shiga, JP;
Kenrou Jitumori, Kyoto, JP;
Inventors:
Seishi Oida, Kyoto, JP;
Sigeki Sakaguchi, Kyoto, JP;
Koji Ohmori, Shiga, JP;
Kenrou Jitumori, Kyoto, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/48 ;
U.S. Cl.
CPC ...
Abstract
A semiconductor device includes a semiconductor element having a plurality of element electrodes and a ball electrode electrically connected to at least one element electrode out of the plurality of element electrodes. The ball electrode is made of a Sn—Zn-based lead-free solder including 7 through 9.5 wt % of zinc and the remaining of tin.