The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2005

Filed:

Mar. 08, 2004
Applicants:

Chien Hua Chen, Shanghai, CN;

Yuan Hsin Peng, Shanghai, CN;

Xiao Hua LI, Shanghai, CN;

Inventors:

Chien Hua Chen, Shanghai, CN;

Yuan Hsin Peng, Shanghai, CN;

Xiao Hua Li, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/302 ;
U.S. Cl.
CPC ...
Abstract

A method for processing integrated circuit devices including a water recycling process. The method includes operating a chemical mechanical planarization process, which includes a discharge for process water. The process water is used to process one or more semiconductor wafers. The method also selectively discharges process water from the discharge. A step of transferring the process water from the chemical mechanical planarization process to a facility process is included. The method then uses the discharged water in the facility process.


Find Patent Forward Citations

Chen, Chien. (2005). Method for operating chemical mechanical polishing ('cmp') tool for the manufacture of semiconductor devices (U.S. Patent No. 6852633). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6852633

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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