The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2005
Filed:
Sep. 19, 2002
Detlef Weber, Hermsdorf, DE;
Detlef Weber, Hermsdorf, DE;
Infineon Technologies AG, Munich, DE;
Abstract
The process is used to electrically insulate adjacent metallic interconnects made from an aluminum-containing alloy, in particular for interconnects which are arranged on a DRAM cell array. A dielectric material is applied to the interconnects and the polymerizable material polymerizes under the action of heat. In a heat-treatment step the dielectric material is polymerized. A step of applying the dielectric material is carried out without a step of applying an interlayer between interconnects and dielectric material. On account of the self-passivation effect of aluminum, a thin AlOfilm, which protects the interconnect from corrosion, is formed on the interconnects.