The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2005
Filed:
Sep. 04, 2002
Shoso Shingubara, Higashi-Hiroshima, JP;
Takayuki Takahagi, Aki-gun, JP;
Hiroyuki Sakaue, Higashi-Hiroshima, JP;
Shoso Shingubara, Higashi-Hiroshima, JP;
Takayuki Takahagi, Aki-gun, JP;
Hiroyuki Sakaue, Higashi-Hiroshima, JP;
Semiconductor Technology Academic Research Center, Kanagawa, JP;
Abstract
The present invention is to provide a process for forming the embedded wires having the higher density and the finer pitch without using catalyzing agent in an economical manner. The electroless plating process of copper according to the present invention includes steps of preparing a substrate, and forming a metal nitride layer containing high melting-point metal on the substrate. The metal nitride layer has a stabilized nitride layer in the vicinity of a top surface thereof. The stabilized nitride layer has a composition ratio of nitrogen atoms over oxygen atoms, which is about 0.4 or more. The process also includes a step of immersing the substrate into a plating solution containing copper so as to displace high melting-point metal contained in the metal nitride layer by copper, thereby forming an electroless copper plating layer on the metal nitride layer.