The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6852561 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 08, 2005

Filed:

Oct. 14, 2003
Applicants:

Agnés Bidard, L'Hay les Roses, FR;

Jean-marc Bureau, Valbonne, FR;

Inventors:

Agnés Bidard, L'Hay les Roses, FR;

Jean-Marc Bureau, Valbonne, FR;

Assignee:

Thomson-CSF, Paris, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/00 ;
U.S. Cl.
CPC ...
Abstract

The invention relates to a new type of encapsulated surface acoustic wave component and to a method for the batch production of such components. The component comprises a surface acoustic wave device on the surface of a substrate. The encapsulation package furthermore comprises the substrate, a first layer located on the substrate and hollowed out locally at least at the level of the active surface of the surface acoustic wave device, a printed circuit covering entire first layer and conductive via holes going through the unit formed by the first layer and the printed circuit so as to provide for the electrical connection of the surface acoustic wave device from the exterior.


Find Patent Forward Citations

Bidard, Agnés. (2005). Encapsulated surface acoustic wave component and method of collective fabrication (U.S. Patent No. 6852561). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6852561

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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