The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2005
Filed:
Sep. 24, 2002
Raymond T. Galasco, Vestal, NY (US);
Roy H. Magnuson, Endicott, NY (US);
Voya R. Markovich, Endwell, NY (US);
Thomas R. Miller, Endwell, NY (US);
Anita Sargent, Endicott, NY (US);
William E. Wilson, Waverly, NY (US);
Raymond T. Galasco, Vestal, NY (US);
Roy H. Magnuson, Endicott, NY (US);
Voya R. Markovich, Endwell, NY (US);
Thomas R. Miller, Endwell, NY (US);
Anita Sargent, Endicott, NY (US);
William E. Wilson, Waverly, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A colloidal metal seed formulation useful for catalytically activating a surface of a non-conductive dielectric substrate in an electroless plating process is provided. The colloidal metal seed formulation includes stannous chloride, palladium chloride, HCl and a surfactant selected from a diphenyloxide disulfonic acid or alkali or alkaline earth metal salt thereof, CHO, an alcohol alkoxylate and mixtures thereof. A method of electroless plating of a conductive metal onto a non-conductive dielectric substrate using the colloidal metal seed formulation is also provided.