The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2005
Filed:
Mar. 15, 2001
Krishna Vepa, Livermore, CA (US);
Duncan Dobson, Woodside, CA (US);
Krishna Vepa, Livermore, CA (US);
Duncan Dobson, Woodside, CA (US);
Wafer Solutions, Inc., Fremont, CA (US);
Abstract
The present invention provides exemplary cluster tool systems and methods for processing wafers, such as semiconductor wafers. One method includes providing () a wafer having initial thickness variations between two wafer surfaces. The wafer is subjected to grinding (), polishing () and cleaning () processes. The wafer is thereafter transferred () to a wafer processing chamber to undergo device formation processes (). The wafer processing steps may be undertaken in a series of process modules of sufficiently small size to permit their use in a circuit device fabrication facility. The in-fab processing of wafers reduces the number of process steps, cost and time typically associated with wafer processing prior to device formation thereon.