The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2005
Filed:
Jul. 03, 2002
Kei Nakamura, Osaka, JP;
Satoshi Tanigawa, Osaka, JP;
Shinya Oota, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A method of producing a multilayer wired circuit board that can provide sufficient adhesion strength of the interface between a conductor layer and a thermosetting adhesive layer laminated, to provide improvement in connection strength between the conductor layers and thus improvement in reliability. In this method, after a thermosetting adhesive layer is formed on a first conductor layer, an opening is formed in the thermosetting adhesive layer and solder powders are charged in the opening at normal temperature. Sequentially, a second conductor layer is formed on the thermosetting adhesive layer including the opening filled with the solder powders. Thereafter, the solder powders are melted by heating, to electrically connect between the first conductor layer and the second conductor layer.