The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Mar. 11, 2003
Yean-sang You, Chungcheongnam-Do, KR;
Heui-seog Kim, Chungcheongnam-Do, KR;
Soo-tae Chae, Chungcheongnam-Do, KR;
Yean-Sang You, Chungcheongnam-Do, KR;
Heui-Seog Kim, Chungcheongnam-Do, KR;
Soo-Tae Chae, Chungcheongnam-Do, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
An integrated management system is provided for automatically executing a procedure of reviewing and editing an assembly reference and a bonding specification used for manufacturing IC packages. The system includes a drawing management system (DMS) that creates the assembly reference, and a bonding specification drawing system that creates, based on the assembly reference, the bonding specification. The integrated management system further includes a DMS database server that stores and manages the assembly reference and the bonding specification, a DMS file server that manages a blank diagram, a package outline, a bonding diagram, and a standard file, and a DMS web server that provides a web interface to a user for permitting a remote access. In particular, the drawing management system has a bonding rule check module that verifies whether the bonding specification meets a bonding rule suitable for an automated wire bonding process. The drawing management system produces the standard file to be transmitted to bonding equipments.