The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6849954 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 01, 2005

Filed:

Aug. 15, 2002
Applicant:

Chun-yuan Lee, Hsinchu, TW;

Inventor:

Chun-Yuan Lee, Hsinchu, TW;

Assignee:

Inpaq Technology Co., Ltd., Miao Li Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2148 ;
U.S. Cl.
CPC ...
Abstract

The present invention relates to an IC package substrate provided with over voltage protection function and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install multiple protection devices on a printed circuit board. Therefore, the costs to design circuits are reduced, the limited space is effectively utilized, and unit costs to install respective protection devices are lowered down.


Find Patent Forward Citations

Lee, Chun-Yuan. (2005). Ic package substrate with over voltage protection function (U.S. Patent No. 6849954). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6849954

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