Semiconductor device and method of manufacturing same

Abstract

Before a semiconductor chip () is mounted on package board (), an insulating layer () is formed on the reverse side of the semiconductor chip () for preventing insulation failures. If the insulating layer () is formed by applying an insulating film, then the insulating layer () reliably achieves a predetermined thickness for reliable electric insulation and can easily be formed. The semiconductor chip () with the insulating layer () formed thereon is fixed to the package board () which has surface interconnections () by an insulating adhesive (adhesive layer). The semiconductor chip () and the surface interconnections () are insulated from each other by the insulating layer (). Therefore, the adhesive may be used in a minimum quantity. Since the semiconductor chip () can be pressed under an increased pressure, the semiconductor chip () is reliably joined to the package board (). Surface irregularities existing on the surface of the package board () due to the surface interconnections () are filled up with and covered by the adhesive, leaving no gaps on the surface of the package board ().