The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Feb. 04, 2002
Masahiro Katsumura, Tsurugashima, JP;
Tetsuya Iida, Tsurugashima, JP;
Nobuhiro Oda, Tokyo-to, JP;
Takashi Ueno, Tokyo-to, JP;
Masahiro Katsumura, Tsurugashima, JP;
Tetsuya Iida, Tsurugashima, JP;
Nobuhiro Oda, Tokyo-to, JP;
Takashi Ueno, Tokyo-to, JP;
Pioneer Corporation, Tokyo-To, JP;
Abstract
A stamper-forming electrode material contains Cu as its main ingredient and at least one other element, preferably Ag and/or Ti. It is preferred that the Ag content be 10.0 wt % or less and that the Ti content be 5.0 wt % or less. A stamper-forming thin film is made of this stamper-forming electrode material, whereby its corrosion resistance is improved to suppress damage to itself, and a high-quality stamper can hence be formed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile