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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6849293 B1

PDFFull Text
Expired
Date of Patent:
Feb. 01, 2005

Filed:

May. 02, 2002

Method to minimize iso-dense contact or via gap filling variation of polymeric materials in the spin coat process

Applicant:

Pawan Rawat, Jaipur, IN;

Inventor:

Pawan Rawat, Jaipur, IN;

Assignee:

Institute of Microelectronics, Singapore, SG;

Attorneys:

George O. Saile

Stephen B. Ackerman

Stephen G. Stanton

Primary Examiner:

Kristen C Jolley

Int. Cl.
CPC ...
B05D 312 ; B05D 700 ;
U.S. Cl.
CPC ...
Abstract

A method for spin coating a polymeric material film upon a wafer rotatably mounted within a spin coater; the wafer having a surface, including the following steps. A first step of rotating the wafer on an axis perpendicular to the wafer surface while applying a predetermined amount of polymeric material while rotating the wafer at a rotational speed of from about 300 to 1200 rpm for from about 2.5 to 5 seconds to spread the polymeric material on the whole surface of the wafer. A second step of increasing the rotational speed of the wafer to about 5500 rpm for about 2.5 seconds. A third step of decreasing the rotational speed of the wafer to about 300 to 1200 rpm for about 2.5 seconds. A fourth step of increasing the rotational speed of the wafer to about 5500 rpm for about 20 seconds to form the polymeric material film having a predetermined thickness over the whole surface of the wafer.

Find Patent Forward Citations

Rawat, Pawan. (2005). Method to minimize iso-dense contact or via gap filling variation of polymeric materials in the spin coat process (U.S. Patent No. 6849293). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6849293

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