The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
May. 11, 2001
Satoru Yamaguchi, Anjyou, JP;
Hitoshi Kanmura, Mie-pref., JP;
Akinobu Muto, Aichi-pref., JP;
Toshiaki Tanida, Okazaki, JP;
Satoru Yamaguchi, Anjyou, JP;
Hitoshi Kanmura, Mie-pref., JP;
Akinobu Muto, Aichi-pref., JP;
Toshiaki Tanida, Okazaki, JP;
Denso Corporation, , JP;
Abstract
A method of manufacturing a honeycomb structure and a through hole forming device used in the manufacture of the honeycomb structure are provided, in which the step of closing a part of the cell ends at an end surface of the honeycomb structure is rationalized. In closing a part of the cell ends () at the end surface () of a honeycomb structure body (), a film () is attached to the end surface () of the honeycomb structure body () in such a manner as to cover the cell ends (). The portion of the film () located at the cell ends () to be closed is thermally melted or burnt off thereby to form through holes (). The end surface () is dipped in a slurry containing an end surface closing material, so that the slurry is caused to enter the cell ends () by way of the through holes (). After that, the slurry is hardened while at the same time removing the resin film ().