The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Dec. 06, 2002
Joseph F. Covington, San Gabriel, CA (US);
Steven E. Hobbs, West Hills, CA (US);
Jeffrey A. Koehler, Pasadena, CA (US);
Paren P. Patel, Sierra Madre, CA (US);
Marci Pezzuto, Pasadena, CA (US);
Mark S. Scheib, La Verne, CA (US);
Joseph F. Covington, San Gabriel, CA (US);
Steven E. Hobbs, West Hills, CA (US);
Jeffrey A. Koehler, Pasadena, CA (US);
Paren P. Patel, Sierra Madre, CA (US);
Marci Pezzuto, Pasadena, CA (US);
Mark S. Scheib, La Verne, CA (US);
Nanostream, Inc., Pasadena, CA (US);
Abstract
A method for fabricating a microfluidic device where first and second substantially flat platens are provided. Multiple substantially planar, substantially metal-free, adhesiveless polymer device layers, the device layers including a first cover layer, second cover layer, and at least one stencil layer defining a microfluidic channel penetrating through the entire thickness of the stencil layer also are provided. Each stencil layer is disposed between other device layers such that the channel is bounded laterally by a stencil layer, and bounded from above and below by surrounding device layers to define an upper channel surface and a lower channel surface. The device layers are stacked between the first platen and the second platen. The stacked device layers are controllably heated according to a heating profile adapted to form a substantially sealed adhesiveless microfluidic device wherein each upper channel surface remains distinct from its corresponding lower channel surface. The resulting microfluidic device has high inter-layer bond strength while preserving the integrity of the channel(s) defined in the stencil layer(s).