The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2005

Filed:

May. 29, 2003
Applicants:

Hisakazu Miyajima, Osaka, JP;

Masao Arakawa, Ashiya, JP;

Akira Yabuta, Cupertino, CA (US);

Jun Sakai, Osaka, JP;

Inventors:

Hisakazu Miyajima, Osaka, JP;

Masao Arakawa, Ashiya, JP;

Akira Yabuta, Cupertino, CA (US);

Jun Sakai, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 114 ; G01L 904 ;
U.S. Cl.
CPC ...
Abstract

A mechanical deformation amount sensor includes a sensor structure which is formed by a semiconductor substrate or an insulating substrate and integrally includes a deformation portion deformable, when a physical quantity to be detected is applied to the sensor structure, due to the physical quantity and a support portion for supporting the deformation portion, a carbon nanotube resistance element which is provided on the deformation portion so as to be mechanically deformed in response to deformation of the deformation portion and a wiring pattern which is formed in a pattern on the sensor structure so as to be connected to the carbon nanotube resistance element. By applying a voltage to the carbon nanotube resistance element via the wiring pattern, a change of electrical conductivity of the carbon nanotube resistance element upon mechanical deformation of the carbon nanotube resistance element is fetched as an electrical signal.


Find Patent Forward Citations

Loading…