The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Mar. 22, 2001
Kazuya Kuriyama, Osaka, JP;
Yoichi Yasue, Osaka, JP;
Kazuya Kuriyama, Osaka, JP;
Yoichi Yasue, Osaka, JP;
Komatsu Ltd., Tokyo, JP;
Abstract
A temperature control device with heat conduction properties such as heat homogeneity, responsiveness or the like is fabricated by improving flatness. In a method of fabricating a temperature control device () equipped with a temperature control element () configured by soft soldering a thermionic element () between the opposed electrodes () and () and a pair of heat conduction plates () and () disposed respectively on outside surfaces of respective insulating substrates () and () of the relevant temperature control device as well as electrodes () and () are formed respectively on opposing surfaces of a pair of insulating substrates () and () disposed in opposed positions, the heat conduction plateis disposed on the outside surface of the insulating substrateafter soft soldering of the thermionic elementis performed, the insulating substratehas the flexibility, in the soft soldering of the thermionic element, the soft soldermixed with copper powder which is a layer thickness control member is used, and the soft soldering is carried out while adding the predetermined pressure.