The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Dec. 10, 2002
Shigeru Tsuzuki, Osaka, JP;
Kunihiro Fujii, Osaka, JP;
Masahiro Takada, Osaka, JP;
Satoshi Matsuo, Kyoto, JP;
Takafumi Koga, Osaka, JP;
Kozo Murakami, Osaka, JP;
Shigeru Tsuzuki, Osaka, JP;
Kunihiro Fujii, Osaka, JP;
Masahiro Takada, Osaka, JP;
Satoshi Matsuo, Kyoto, JP;
Takafumi Koga, Osaka, JP;
Kozo Murakami, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A method of manufacture of a surface acoustic wave device which includes a step of applying a photosensitive film resist on a substrate and forming a photosensitive film resist layer over at least a portion of a surface of the substrate; a step of forming acoustic absorbers only at the two sides orthogonal to the direction of the surface acoustic wave transmission; a step of placing in a package a surface acoustic wave element obtained by cutting and dividing the substrate and electrically connecting a connection electrode of the surface acoustic wave element with an external terminal of the package; and a step of sealing an opening of the package with a lid, wherein the main surface of the acoustic absorbers is formed parallel to the surface of the substrate.