The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2005
Filed:
Apr. 02, 2002
Jeff Blackwood, Portland, OR (US);
Jeff Blackwood, Portland, OR (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
A silicon device which includes a silicon substrate and a bond pad array on the silicon substrate which is configured to be conductively connected to bond wire. The bond pad array consists of a plurality of bond pads which are vertically staggered on the silicon substrate. The vertical staggering allows the bond pads to be packed closer together on the silicon substrate, thereby reducing the horizontal space which is consumed by the bond pads on the silicon substrate, and thereby resulting in a reduction in die size. Preferably, the bond pads are also horizontally staggered on the silicon substrate, thereby allowing the bond pads to be spaced even closer together.