The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2005

Filed:

Dec. 04, 2002
Applicants:

Steven H. C. Hsieh, Cupertino, CA (US);

Siuki Chan, Cupertino, CA (US);

Inventors:

Steven H. C. Hsieh, Cupertino, CA (US);

Siuki Chan, Cupertino, CA (US);

Assignee:

Xilinx, Inc., San Jose, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B 100 ;
U.S. Cl.
CPC ...
Abstract

Disclosed is a DC thermal energy generator for heating localized regions of an integrated circuit. The integrated circuit includes a pair of static circuits whose outputs are shorted, and are in contention. Contention causes current to flow through the circuits, generating heat. Integrated-circuit temperatures can be varied by turning on more or fewer thermals energy generators. The thermal resistance of a, packaged integrated circuit is computed using a well-known relationship integrated circuit's measured temperature, power consumption, and the ambient temperature.


Find Patent Forward Citations

Hsieh, Steven H. C.. (2005). Methods and circuits for measuring the thermal resistance of a packaged ic (U.S. Patent No. 6847010). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6847010

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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