The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2005
Filed:
Jan. 27, 2003
Ranganathan Nagarajan, Singapore, SG;
Chirayarikathuveedu Sankarapillai Premachandran, Singapore, SG;
Yu Chen, Singapore, SG;
Vaidyanathan Kripesh, Singapore, SG;
Ranganathan Nagarajan, Singapore, SG;
Chirayarikathuveedu Sankarapillai Premachandran, Singapore, SG;
Yu Chen, Singapore, SG;
Vaidyanathan Kripesh, Singapore, SG;
Institute of Microelectronics, Singapore, SG;
Abstract
A method for forming wafers having through-wafer vias for wafer-level packaging of devices, the method comprising the steps of depositing metal on one of two wafers; bonding the two wafers using the metal deposited on the one of the two wafers; forming a through-wafer via in one of the two wafers; filling the through-wafer via with a conductive material; and forming a cavity in the one of the two wafers having the through-wafer via wherein the cavity is superposable over a device.