The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2005
Filed:
Apr. 19, 2002
Matthew Francis O'keefe, Aycliffe Village, GB;
John Melvyn Cullen, Darlington, GB;
Matthew Francis O'Keefe, Aycliffe Village, GB;
John Melvyn Cullen, Darlington, GB;
Filtronic Compound Semiconductor Ltd., Durham, GB;
Abstract
A method of handling a semiconductor wafer from which a plurality of semiconductor devices are to be fabricated during a semiconductor device fabrication process. The method includes the steps of attaching a flexible connected layer to a semiconductor wafer layer mounted on a carrier substrate and separating the wafer layer from the carrier substrate while supported by the flexible connected layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile