The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2005
Filed:
Oct. 22, 2003
Chin-long Wu, Tainan, TW;
Tung-yang Tang, Hsinchu, TW;
Shih-ming Hsu, Miaoli, TW;
Shang-wei Chen, Jubei, TW;
Chin-Long Wu, Tainan, TW;
Tung-Yang Tang, Hsinchu, TW;
Shih-Ming Hsu, Miaoli, TW;
Shang-Wei Chen, Jubei, TW;
RiTdisplay Corporation, Hsinchu, TW;
Abstract
A process of packaging an OEL panel is disclosed. A printed circuit board is provided, wherein the printed circuit board comprises a plurality of bonding pads and a plurality of bumps on the bonding pads. Next, at least one OEL panel having a plurality of polysolder interconnections is provided. Next, the OEL panel disposed on the printed circuit board. A reflow process is performed so that the OEL panel can electrically connect with the PCB by the polysolder interconnections. Because of the low-temperature reflow process, the process of packaging an OEL panel can be accomplished by a low temperature process.