The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2005
Filed:
May. 10, 2002
Applicant:
Kia-seng Low, Hopewell Junction, NY (US);
Inventor:
Kia-Seng Low, Hopewell Junction, NY (US);
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2100 ;
U.S. Cl.
CPC ...
Abstract
A semiconductor device () and method of fabrication thereof, wherein a plurality of conductive lines () are formed over a workpiece, a surface-smoothing conductive material () is disposed over the conductive lines (), and a magnetic material () disposed is over the surface-smoothing conductive material (). The surface-smoothing conductive material () has a smaller grain structure than the underlying conductive lines (). The surface-smoothing conductive material () is polished so that the surface-smoothing conductive material () has a texturally smoother surface than the surface of the conductive lines ().