The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2005
Filed:
Nov. 12, 2003
Applicants:
Akiko Matsumura, Ibaraki, JP;
Kazuki Uwada, Ibaraki, JP;
Naoki Sadayori, Ibaraki, JP;
Yuji Hotta, Ibaraki, JP;
Inventors:
Akiko Matsumura, Ibaraki, JP;
Kazuki Uwada, Ibaraki, JP;
Naoki Sadayori, Ibaraki, JP;
Yuji Hotta, Ibaraki, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 7310 ; C08G 1800 ; B32B 300 ;
U.S. Cl.
CPC ...
Abstract
An adhesive film for underfill which relaxes the stress formed in the wiring circuit substrate, semiconductor element and electrode parts for connection. The adhesive film is a quickly hardening type, and forms a highly heat resistant sealing resin layer quickly between the wiring circuit substrate and semiconductor element of a semiconductor device.