The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2005

Filed:

May. 15, 2003
Applicants:

Xian-li Yeh, Walnut, CA (US);

Gang Paul Chen, Walnut, CA (US);

Inventors:

Xian-Li Yeh, Walnut, CA (US);

Gang Paul Chen, Walnut, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 595 ;
U.S. Cl.
CPC ...
Abstract

Locally heated low temperature solder glass is used to permanently fix an optical fiber with sub-micron precision to a glass ceramic submount inside a high power pump laser module. The fiber is manipulated into a predetermined alignment while the solder glass is still molten and the solder glass is then cooled to its solidified state. The predetermined alignment may include an offset to compensate for subsequent thermally related dimensional changes as the solder glass cools and solidifies. If necessary, the solder glass can be remelted and the fiber realigned with a different offset if the first alignment attempt is less than optimal. This alignment process has been demonstrated to provide reliable and efficient coupling of an optical fiber to a high power pump laser within very tight tolerances. A similar process can also be applied to other micro-optics assemblies where high precision, high reliability fiber fixing is required.


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