The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2005
Filed:
Nov. 19, 2002
Xiao-qi Zhou, San Diego, CA (US);
Henry Wevick, Rialto, CA (US);
Nancy Iwamoto, Ramona, CA (US);
Shao Wei LI, San Diego, CA (US);
Alan Grieve, El Cajon, CA (US);
Xiao-Qi Zhou, San Diego, CA (US);
Henry Wevick, Rialto, CA (US);
Nancy Iwamoto, Ramona, CA (US);
Shao Wei Li, San Diego, CA (US);
Alan Grieve, El Cajon, CA (US);
Honeywell International Inc., Morristown, NJ (US);
Abstract
Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile