The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2005
Filed:
Aug. 17, 2001
Kai Hwa Chew, Singapore, SG;
Wei Chih Pan, Singapore, SG;
Kai Hwa Chew, Singapore, SG;
Wei Chih Pan, Singapore, SG;
Quantum Chemical Technologies (Singapore) Pte Ltd, Singapore, SG;
Singapore Asahi Chemical and Solder Industries Pte Ltd, Singapore, SG;
Abstract
A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile