The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Oct. 02, 2003
John M. Waldvogel, Libertyville, IL (US);
Brian R. Bielick, Carpentersville, IL (US);
Herman J. Miller, Algonquin, IL (US);
Billy J. Van Cannon, Chicago, IL (US);
John M. Waldvogel, Libertyville, IL (US);
Brian R. Bielick, Carpentersville, IL (US);
Herman J. Miller, Algonquin, IL (US);
Billy J. Van Cannon, Chicago, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An electrical circuit apparatus () that includes: a substrate () having a ground layer (), at least one device aperture (), and at least one solder aperture (); a heat sink (); and an adhesive layer () for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.