The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Oct. 31, 2002
Marie-claire Cyrille, San Jose, CA (US);
Wen-chien David Hsiao, San Jose, CA (US);
Yongho Sungtaek Ju, San Jose, CA (US);
Wen-yaung Lee, San Jose, CA (US);
Stefan Maat, San Jose, CA (US);
Howard Gordon Zolla, San Jose, CA (US);
Marie-Claire Cyrille, San Jose, CA (US);
Wen-Chien David Hsiao, San Jose, CA (US);
Yongho Sungtaek Ju, San Jose, CA (US);
Wen-Yaung Lee, San Jose, CA (US);
Stefan Maat, San Jose, CA (US);
Howard Gordon Zolla, San Jose, CA (US);
Hitachi Global Storage Technologies, Amsterdam, NL;
Abstract
A magnetic head has highly thermally conductive insulator materials containing cobalt-oxide so that heat can more effectively dissipate from the magnetic head. In one illustrative example, the magnetic head has first and second gap layers and a read sensor disposed between the first and the second gap layers. The first and the second gap layers are advantageously made of cobalt-oxide (CoO) (e.g. CoO or CoO), which may exhibit a thermal conductivity of between 5-8 watts/meter-Kelvin or greater. In another illustrative example, a magnetic head is made of a substrate; first and second shield layers; an undercoat layer formed between the substrate and the first shield layer; first and second gap layers formed between the first and the second shield layers; and a read sensor formed between the first and the second gap layers. The undercoat layer is also made of CoO. The improved dissipation of heat from the magnetic head improves the read sensor performance and reduces the likelihood of other problems, such as head-to-disk interface problems.