The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
May. 20, 2002
Chihiro Araki, Shuuchi-gun, JP;
Chihiro Araki, Shuuchi-gun, JP;
Kabushiki Kaisha Moric, Mori-machi, JP;
Abstract
A semiconductor chip mounted on a substrate having a soldering land pattern for containing a molten solder interposed between said conductive surface and a facing surface of the semiconductor chip. The soldering land pattern comprises corners spaced respectively from the four corners of the semiconductor chip bottom surface and escapes formed between the corners sufficiently outside of the respective sides of the semiconductor chip bottom surface to accept liquid solder displaced from the area between the conductive surface and the facing surface of the semiconductor chip upon placing the semiconductor chip within the soldering land pattern to improve conductivity and simplify the construction. The device is also shown in a motor control.