The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2005

Filed:

Nov. 10, 2003
Applicant:

Ikuya Miyazawa, Chino, JP;

Inventor:

Ikuya Miyazawa, Chino, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2940 ;
U.S. Cl.
CPC ...
Abstract

A depression is formed from a first surface of a semiconductor substrate on which is formed an integrated circuit. An insulating layer is provided on the inner surface of the depression. A first conductive portion is provided on the inside of the insulating layer. A second conductive portion is formed on the inside of the insulating layer and over the first conductive portion, of a different material from the first conductive portion. The first conductive portion is exposed from a second surface of the semiconductor substrate opposite to the first surface.


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Miyazawa, Ikuya. (2005). Semiconductor device and method of manufacturing the same, circuit board and electronic instrument (U.S. Patent No. 6841849). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6841849

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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