The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2005

Filed:

Jul. 28, 2003
Applicants:

Chien-hung Liu, Hsinchu Hsien, TW;

Jian-chiun Liou, Hsinchu Hsien, TW;

Chun-jung Chen, Hsinchu Hsien, TW;

Je-ping HU, Hsinchu Hsien, TW;

Inventors:

Chien-Hung Liu, Hsinchu Hsien, TW;

Jian-Chiun Liou, Hsinchu Hsien, TW;

Chun-Jung Chen, Hsinchu Hsien, TW;

Je-Ping Hu, Hsinchu Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2976 ; G01R 1900 ;
U.S. Cl.
CPC ...
Abstract

A MOSFET and the method for fabricating them are disclosed to make the inkjet head chips. The MOSFET has the scaled-down junction formation for the source and drain. Using a lower temperature process and interlayer dielectric, the source and drain dopants can not be diffused deeply due to high-temperature driver-in. The contact holes of the drain are provided with plugs of refractory material to avoid spiking between the metal and silicon. This achieves the requirement of high-density devices on the print head chip.


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