The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Apr. 18, 2001
Applicants:
Kouki Ogawa, Aichi, JP;
Eiji Kodera, Aichi, JP;
Inventors:
Kouki Ogawa, Aichi, JP;
Eiji Kodera, Aichi, JP;
Assignee:
NGK Spark Plug Co., Ltd., Aichi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 103 ; H05K 109 ;
U.S. Cl.
CPC ...
Abstract
A printed-wiring substrate including a capacitor element, as well as a method for fabricating the printed-wiring substrate. An insulating substrateis molded by placing a capacitor elementin a mold and charging a resininto the mold. Therefore, the capacitor elementhaving a size (i.e., electrostatic capacitance) sufficient to suppress switching noise of an IC chipand stabilize operation power voltage can be disposed, while providing a dimensional margin. Since the possibility of failing to embed the capacitor elementdecreases, the printed-wiring substrate can be fabricated at reduced cost.