The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2005

Filed:

Aug. 28, 2000
Applicant:

Chihiro Uchibori, Kawasaki, JP;

Inventor:

Chihiro Uchibori, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2144 ;
U.S. Cl.
CPC ...
Abstract

A semiconductor device comprising: a base substrate including a semiconductor substrateand a semiconductor element formed on the semiconductor substrate; an insulation filmformed on the base substrate having an opening; and a metal interconnectionformed buried in the openingincluding: a barrier layerformed on an inside wall and a bottom of the opening; an adhesion layercontaining zirconium formed on the barrier layer; and a metal interconnection materialcontaining copper as a main component formed on the barrier layer. Whereby the peeling of the copper interconnection in the fabrication process can be prevented. The electro migration resistance and stress migration resistance of the copper interconnection can be further improved.


Find Patent Forward Citations

Loading…