The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Feb. 08, 2001
Shinsuke Kishi, Saitama, JP;
Hideaki Yoshimura, Shizuoka, JP;
Shinsuke Kishi, Saitama, JP;
Hideaki Yoshimura, Shizuoka, JP;
Sony Disc Technology Inc., , JP;
Abstract
The present invention is directed to an injection molding apparatus and method capable of preventing the occurrence of over-packing. The apparatus includes a pair of dies for forming a plurality of cavities therebetween; die closing devices for closing the pair of dies under a prescribed pressure; an injection device for injecting a molten resin into respective cavities under a prescribed pressure; and, a control device for controlling the die closing devices and the injection device. Further, the apparatus comprises a plurality of pressure sensors for detecting respective pressures in respective cavities and a control device that controls the injection device and/or the die closing devices to reduce the rate of injection of the molten resin and/or the force of closing the dies and, otherwise, stops the injection and/or the die closing operation when the pressure difference between cavities is found to be greater than a prescribed value on the basis of sensed values from the respective pressure sensors.