The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Jan. 28, 2003
Angus Kingon, Cary, NC (US);
Gregory J. Dunn, Arlington Heights, IL (US);
Stephen Streiffer, Oak Park, IL (US);
Kevin Cheek, Raleigh, NC (US);
Min-xian Zhang, Algonquin, IL (US);
Jon-paul Maria, Raleigh, NC (US);
Jovica Savic, Downers Grove, IL (US);
Angus Kingon, Cary, NC (US);
Gregory J. Dunn, Arlington Heights, IL (US);
Stephen Streiffer, Oak Park, IL (US);
Kevin Cheek, Raleigh, NC (US);
Min-Xian Zhang, Algonquin, IL (US);
Jon-Paul Maria, Raleigh, NC (US);
Jovica Savic, Downers Grove, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A dielectric film is formed on a free-standing conductive metal layer to form a multi-layer foil comprising a conductive metal layer, a barrier layer and a dielectric oxide layer. Such multi-layer foils are mechanically flexible, and useful for the manufacture of capacitors. Examples of barrier layers include Ni—P or Ni—Cr alloys. After a second layer of conductive metal is deposited on a dielectric oxide surface opposing the first conductive metal layer, the resulting capacitor foil is processed into a capacitor. The resulting capacitor is a surface mounted capacitor or is formed as a integrated or embedded capacitor within a circuit board.