The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Dec. 11, 2002
Tetsuro Tsukada, Ibaraki, JP;
Tutomu Fusyuku, Chiba, JP;
Tetsuro Tsukada, Ibaraki, JP;
Tutomu Fusyuku, Chiba, JP;
Asahi Glass Company, Limited, Tokyo, JP;
Abstract
A method for joining films having a hydrophilized surface at a single surface and an excellent melt-bonding force at the melt-bonded portion, which is formed by disposing two films (A) having a hydrophilized surface at a single surface, to align the hydrophilized surfaces so as to butt each end portion; overlaying a film (B) on a side of non-hydrophilized surface of the films (A), so as to bridge the butting portion, and hot-pressing the overlapping portion (c1)5 to join the two films (A). A wide film obtained by the above-mentioned method is suitable for a covering material for agricultural use.