The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2005

Filed:

Sep. 11, 2002
Applicants:

Gerald Wolford, Montreal, CA;

James Mills, Brossard, CA;

Steven E. Minich, York, PA (US);

Christopher J. Kolivoski, York, PA (US);

John D. Dodds, Hummelstown, PA (US);

James R. Volstorf, Mechanicsburg, PA (US);

Wilfred J. Swain, Mechanicsburg, PA (US);

James S. Staron, Halifax, PA (US);

Inventors:

Gerald Wolford, Montreal, CA;

James Mills, Brossard, CA;

Steven E. Minich, York, PA (US);

Christopher J. Kolivoski, York, PA (US);

John D. Dodds, Hummelstown, PA (US);

James R. Volstorf, Mechanicsburg, PA (US);

Wilfred J. Swain, Mechanicsburg, PA (US);

James S. Staron, Halifax, PA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 2500 ;
U.S. Cl.
CPC ...
Abstract

A press-fit bus-bar for distributing power along a backplane or a printed circuit board includes a number of flat bus bar conductors fabricated from an electrically conductive material. Each bus bar conductor is separated from adjacent bus bar conductors by layers of an insulating material. A number of electrically conductive press-fit tails protrude from one edge of each bus bar conductor. When the laminated bus bar conductors and insulating material layers are placed in a housing which is then filled with a hardened epoxy resin, the press-fit tails protrude from the surface of that epoxy resin. These protruding tails can be press-fit in a backplane(s) or printed circuit board(s) for the purpose of supplying these backplane(s) or printed circuit board(s) with electric power.


Find Patent Forward Citations

Loading…