The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2005

Filed:

Jan. 18, 2002
Applicants:

Igor Y. Khandros, Orinda, CA (US);

Benjamin N. Eldridge, Danville, CA (US);

Treliant Fang, Dublin, CA (US);

Gaetan L. Mathieu, Livermore, CA (US);

Gary W. Grube, Pleasanton, CA (US);

Michael A. Drush, Tracy, CA (US);

Christopher C. Buckholtz, Livermore, CA (US);

Inventors:

Igor Y. Khandros, Orinda, CA (US);

Benjamin N. Eldridge, Danville, CA (US);

Treliant Fang, Dublin, CA (US);

Gaetan L. Mathieu, Livermore, CA (US);

Gary W. Grube, Pleasanton, CA (US);

Michael A. Drush, Tracy, CA (US);

Christopher C. Buckholtz, Livermore, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65D 6900 ; B32B 500 ; B32B 904 ;
U.S. Cl.
CPC ...
Abstract

A probe cleaning apparatus for cleaning a probe tip use to test semiconductors dies having an abrasive substrate layer an a tacky gel layer on top of the abrasive surface of the abrasive substrate layer. The probe tip is cleaned by passing it through the tacky gel layer so that it comes in contact with the abrasive surface of the abrasive substrate, moving the probe tip across the abrasive surface of the substrate layer, and then removing the probe tip from the successive layers of the cleaning apparatus. The probe tip emerges from the cleaning apparatus free from debris associated with testing the semiconductor dies.


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