The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2005

Filed:

Jun. 20, 2001
Applicants:

Yuji Kikuchi, Ibaraki, JP;

Kiyoharu Kishimoto, Yokohama, JP;

Kazunari Nakagawa, Tokyo, JP;

Yoshiharu Hino, Moriya, JP;

Inventors:

Yuji Kikuchi, Ibaraki, JP;

Kiyoharu Kishimoto, Yokohama, JP;

Kazunari Nakagawa, Tokyo, JP;

Yoshiharu Hino, Moriya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2348 ;
U.S. Cl.
CPC ...
Abstract

A semiconductor chip of rewiring layer-integral type capable of preventing a maloperation by noise and a deterioration of communication characteristics and a semiconductor device with excellent communication characteristics; the semiconductor chip, wherein a rewiring layer () is formed on a circuit formed surface () through an insulating layer () so as to form an antenna coil () with the rewiring layer (), the antenna coil () is formed around the periphery of an analog circuit () on the circuit formed surface () by avoiding forming on the analog circuit (), the analog circuit () may be formed by collecting analog circuits to be formed in the semiconductor chip (A) therein, may be one of the particularly noise-susceptible analog circuits such as a power circuit, a calculation amplifier, a comparison amplifier, an RF receiving part, an RF transmitting part, an RF synthesizer part, and a voltage build-up circuit and an amplifying circuit forming a part of a memory part, or may be a coil provided in a part of the analog circuit formed in the semiconductor chip (A).


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