The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2005
Filed:
Dec. 16, 1999
Sailesh Chittipeddi, Allentown, PA (US);
William Thomas Cochran, Clermont, FL (US);
Yehuda Smooha, Allentown, PA (US);
Sailesh Chittipeddi, Allentown, PA (US);
William Thomas Cochran, Clermont, FL (US);
Yehuda Smooha, Allentown, PA (US);
Agere Systems Inc., Allentown, PA (US);
Abstract
A bond pad is located over active circuitry formed within an integrated circuit device. A barrier film forms the bottom surface of the upper portion of a bond pad opening which also includes vias extending through the bottom surface to form a dual damascene structure. The bond pad is resistant to stress effects such as cracking, which can be produced when bonding an external wire to the bond pad, and therefore prevents leakage currents between the bond pads and the underlying circuitry.