The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2005

Filed:

May. 09, 2003
Applicants:

Toshiya Ishio, Nabari, JP;

Hiroyuki Nakanishi, Soraku-gun, JP;

Katsunobu Mori, Nara, JP;

Yoshihide Iwazaki, Soraku-gun, JP;

Shinji Suminoe, Tenri, JP;

Inventors:

Toshiya Ishio, Nabari, JP;

Hiroyuki Nakanishi, Soraku-gun, JP;

Katsunobu Mori, Nara, JP;

Yoshihide Iwazaki, Soraku-gun, JP;

Shinji Suminoe, Tenri, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23552 ;
U.S. Cl.
CPC ...
Abstract

A semiconductor chip of the present invention is so arranged that a front face on which an element circuit is formed has electrode pads and a side face and a back face are coated with a shielding layer for shielding electromagnetic waves. With this, it is possible to provide a semiconductor element capable of being easily manufactured into a smaller semiconductor device compared with a conventional semiconductor device equipped with a shielding cap; a semiconductor device; and a method for manufacturing a semiconductor element.


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