The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2005
Filed:
Feb. 13, 2004
Takashi Yamaguchi, Kanagawa, JP;
Takashi Kobayashi, Kanagawa, JP;
Toshimasa Kobayashi, Kanagawa, JP;
Satoru Kijima, Miyagi, JP;
Satoshi Tomioka, Kanagawa, JP;
Shinichi Ansai, Miyagi, JP;
Tsuyoshi Tojo, Miyagi, JP;
Takashi Yamaguchi, Kanagawa, JP;
Takashi Kobayashi, Kanagawa, JP;
Toshimasa Kobayashi, Kanagawa, JP;
Satoru Kijima, Miyagi, JP;
Satoshi Tomioka, Kanagawa, JP;
Shinichi Ansai, Miyagi, JP;
Tsuyoshi Tojo, Miyagi, JP;
Sony Corporation, Tokyo, JP;
Abstract
The nitride-based semiconductor laser devicehas a stacked structure comprising a first contacting layer, a first cladding layer, an active layer, a second cladding layer, a second contacting layerand a second electrodewhich are consecutively stacked, the second cladding layercomprises a lower layerA and an upper layerB, the first cladding layer, the active layerand the lower layerA of the second cladding layer have a mesa structure, the upper layerB of the second cladding layer and the second contacting layerhave a ridge structure, an insulating layercovering at least part of each of both side surfaces of the upper layerB of the second cladding layer is formed on the portions of the lower layerA of the second cladding layer which portions correspond to the top surface of the mesa structure, and further, a metal layerhaving substantially the same width as the mesa structure is formed on the top surface of the insulating layerand the top surface of the second electrodesuch that the metal layercontinues from one top surface to the other.