The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2005

Filed:

Aug. 04, 2000
Applicants:

Sadamitsu Murayama, Osaka, JP;

Michikage Matsui, Osaka, JP;

Masanori Wada, Osaka, JP;

Shigeru Ishihara, Ehime, JP;

Inventors:

Sadamitsu Murayama, Osaka, JP;

Michikage Matsui, Osaka, JP;

Masanori Wada, Osaka, JP;

Shigeru Ishihara, Ehime, JP;

Assignee:

Teijin Limited, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
D02G 300 ; D21H 1300 ;
U.S. Cl.
CPC ...
Abstract

A heat-resistant fiber paper sheet which is formed from staple fibers made from a heat-resistant organic polymer, undrawn or low ratio drawn para-aromatic polyamide staple fibers, and an organic resin binder and/or fibrids comprising a heat-resistant organic polymer as main components, wherein the amount of said staple fibers is 45 to 97 percent by weight based on the total amount of said heat-resistant fiber paper sheet; the total amount of said organic resin binder and/or said fibrids is 3 to 55 percent by weight based on the total amount of said heat-resistant fiber paper sheet; and said organic resin binder is cured, and/or said undrawn or low ratio drawn para-aromatic polyamide staple fibers and said fibrids are partially softened, deformed and/or melted to exhibit the actions of binders. The obtained heat-resistant fiber paper sheet has excellent heat resistance, excellent heat dimensional stability, excellent plybond strength, an excellent electric insulating property in a high humidity, and the like, has good resin impregnability in spite of having a high bulk density, and is especially suitable for use as a substrate for electric insulating materials or as a substrate for laminates used for electric circuits.


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